Introduction

WG5

Open F1/W1/E1/X2/Xn interfaces

Profile 3GPP-specified higher layer split interfaces to be truly inter-operable between vendors (focus on X2, F1, Xn, E1 and W1 interfaces), including the definition of the relevant management models for operation & maintenance support, and interoperability test cases, as applicable.  WG5 also defines a transport specification to enhance openness at transport level for the network elements within its scope (higher layer split interfaces).

Profile specifications

• Describe e.g., definition of IEs, general behavior of each node, etc. which will not be specified in 3GPP specifications

NOTE: The profile spec discussed by WG5 shall not violate 3GPP specifications

O&M specifications

• Describe CU/DU O&M functions (e.g. alarms, configurations, monitoring,…)

• Should be consistent with the overall O&M framework established by WG10

IOT specification

• Specification for inter-operability testing of higher layer split profiled use cases

Potential enhancements of 3GPP specifications (F1/E1/W1/X2/Xn)

• Gap analysis between 3GPP spec and fully operable multi-vendor spec

• If needed (i.e. in critical cases) identify and propose functions to be added to the 3GPP spec (O-RAN individual companies may decide to submit proposals to 3GPP)

NTT DOCOMO (DCM): Ryusuke Matsukawa

Rakuten Mobile Inc (RMI): Veluchamy Lingasamy

Ericsson (ERI): Kurt Essigmann